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Radiation susceptibility of electronic devices is commonly studied as a function of radiation energetics and device physics. Often overlooked is the presence or magnitude of the electrical field, which we hypothesize to play an influential role in low energy radiation. Accordingly, we present a comprehensive study of low-energy proton irradiation on gallium nitride high electron mobility transistors (HEMTs), turning the transistor ON or OFF during irradiation. Commercially available GaN HEMTs were exposed to 300 keV proton irradiation at fluences varying from 3.76 × 10¹²to 3.76 × 10¹⁴cm², and the electrical performance was evaluated in terms of forward saturation current, transconductance, and threshold voltage. The results demonstrate that the presence of an electrical field makes it more susceptible to proton irradiation. The decrease of 12.4% in forward saturation and 19% in transconductance at the lowest fluence in ON mode suggests that both carrier density and mobility are reduced after irradiation. Additionally, a positive shift in threshold voltage (0.32 V and 0.09 V in ON and OFF mode, respectively) indicates the generation of acceptor-like traps due to proton bombardment. high-resolution transmission electron microscopy and energy dispersive x-ray spectroscopy analysis reveal significant defects introduction and atom intermixing near AlGaN/GaN interfaces and within the GaN layer after the highest irradiation dose employed in this study. According toin-situRaman spectroscopy, defects caused by irradiation can lead to a rise in self-heating and a considerable increase in (∼750 times) thermoelastic stress in the GaN layer during device operation. The findings indicate device engineering or electrical biasing protocol must be employed to compensate for radiation-induced defects formed during proton irradiation to improve device durability and reliability.

 

We examine the DC and radio frequency (RF) response of superconducting transmission line resonators comprised of very thin NbTiN films, [Formula: see text] in thickness, in the high-temperature limit, where the photon energy is less than the thermal energy. The resonant frequencies of these superconducting resonators show a significant nonlinear response as a function of RF input power, which can approach a frequency shift of [Formula: see text] in a [Formula: see text] span in the thinnest film. The strong nonlinear response allows these very thin film resonators to serve as high kinetic inductance parametric amplifiers. 

Sc has been employed as an electron contact to a number of two-dimensional (2D) materials (e.g. MoS₂, black phosphorous) and has enabled, at times, the lowest electron contact resistance. However, the extremely reactive nature of Sc leads to stringent processing requirements and metastable device performance with no true understanding of how to achieve consistent, high-performance Sc contacts. In this work, WSe₂transistors with impressive subthreshold slope (109 mV dec⁻¹) andI_ON/I_OFF(10⁶) are demonstrated without post-metallization processing by depositing Sc contacts in ultra-high vacuum (UHV) at room temperature (RT). The lowest electron Schottky barrier height (SBH) is achieved by mildly oxidizing the WSe₂in situbefore metallization, which minimizes subsequent reactions between Sc and WSe₂. Post metallization anneals in reducing environments (UHV, forming gas) degrade theI_ON/I_OFFby ~10³and increase the subthreshold slope by a factor of 10. X-ray photoelectron spectroscopy indicates the anneals increase the electron SBH by 0.4–0.5 eV and correspondingly convert 100% of the deposited Sc contacts to intermetallic or scandium oxide. Raman spectroscopy and scanning transmission electron microscopy highlight the highly exothermic reactions between Sc and WSe₂, which consume at least one layer RT and at least three layers after the 400 °C anneals. The observed layer consumption necessitates multiple sacrificial WSe₂layers during fabrication. Scanning tunneling microscopy/spectroscopy elucidate the enhanced local density of states below the WSe₂Fermi level around individual Sc atoms in the WSe₂lattice, which directly connects the scandium selenide intermetallic with the unexpectedly large electron SBH. The interface chemistry and structural properties are correlated with Sc–WSe₂transistor and diode performance. The recommended combination of processing conditions and steps is provided to facilitate consistent Sc contacts to WSe₂.

 

Palladium (Pd) electrodes have enabled superior performance in Te‐based devices. Theory predicts strong Fermi level (EF) pinning near the Te valence band, which likely explains the predominantp‐type conduction in Te transistors. The effects of the native TeOx on the contact polarity has not been explored. In this work, X‐ray and ultraviolet photoelectron spectra (XPS and UPS, respectively) reveal the native surface oxide de‐pins the EF between Pd and trigonal Te (t‐Te) and can reduce contact resistance of hole and electron contacts to Te for back end of line‐compatible complementary logic circuits. Atomic hydrogen reduces the native t‐Te oxide below the XPS detection limit, after which, the EF resides near the t‐Te conduction band edge. Therefore, ann‐type band alignment is formed between Pd and t‐Te via an atomic hydrogen treatment. Furthermore, UPS shows the EF is pinned near the t‐Te conduction band edge. XPS indicates the formation of a PdTex intermetallic at the Pdt‐Te interface also affects the electrostatics of the interface. The concentration of PdTex is 40% higher when TeO_xis removed from the t‐Te surface before Pd metallization, likely the root cause of the low (pinned) work function when the native oxide is absent.